BSAC Seminar: Ultrasonic Depth Sensing on a Chip

February 5, 2013

Richard J. Przybyla

Department of Electrical Engineering and Computer Sciences, UC Berkeley
BSAC Graduate Student Researcher
February 5, 2013 | 12:00 to 06:00 | 540 Cory Hall, DOP Center Conference Room
Host: Bernhard Boser

Optical 3D imagers for gesture recognition, such as Microsoft Kinect, suffer from large size and high power consumption. Their performance depends on ambient illumination and they generally cannot operate in sunlight. These factors have prevented widespread adoption of gesture interfaces in energy- and volume-limited environments such as tablets and smartphones. Gesture recognition using sound is an attractive candidate to overcome these difficulties because of the potential for chip-scale solution size, low power consumption, and ambient light insensitivity. Our research focuses on building a 2D ultrasonic depth sensor system using batch-fabricated micromachined aluminum nitride (AlN) ultrasonic transducer arrays and custom CMOS electronics. We have made significant progress towards this goal by demonstrating a 2D rangefinder which measures distance and angle to objects up to 750mm away.

www.eecs.berkeley.edu/~rjp; bsac.berkeley.edu/directory/zoom?PersonID=1219781133

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Dalene Schwartz Corey