Dr. Erkan Aktakka
Department of Electrical and Computer Engineering, University of Michigan
February 19, 2013 | 12:00 to 01:00 | 540 Cory Hall, DOP Center Conference Room
Host: Michel Maharbiz
The rapid advances in solid-state electronics have opened a new era on how we interact with our environment. Micro transducers play an important role in this development by functionalizing the electronic devices to sense, transfer or respond to environmental or user data inputs. Within this context, smart materials can enable unique energy transduction mechanisms between different physical domains. In this talk, I will outline our efforts to enhance the functionalities of next generation smart microsystems via microfabrication based on high quality piezoelectric and thermoelectric thin films, multi-physics modelling and design optimizations, and integration of application specific electronics into these systems. Some of our technology platforms include bonding, thinning and patterning of bulk-PZT on silicon in a thickness range of 5-100 μm with high wafer-level uniformity (±0.5 μm), and co-evaporation of bismuth/antimony telluride thermoelectric thin films with low contact resistance. Based on these processes, we realized several high-performance transducers, including high-stroke diaphragm actuators with 10-30 μm displacements at resonance (15-110 kHz), a 200-μW-output micro vibration energy harvester packaged with its self-supplied power management IC, and a thermal energy harvester integrated on a FinFET CMOS substrate. The talk will also discuss future challenges as well as opportunities for smart micro transducers.
sitemaker.umich.edu/aktakka/home
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