Dr. Rishi Kant
Postdoctoral Researcher, Department of Bioengineering and Therapeutic Sciences, UCSF
BSAC MS 2005
October 19, 2010 | 12:30 to 01:30 | 540 Cory Hall, DOP Center Conference Room
Host: John Huggins
Over the last decade, designers have sought to supplement traditional micro-fabrication with the ability to create 3D curved surfaces, in order to build new and novel micro-devices. One such technique is silicon migration (also known as hydrogen annealing in the MEMS community), which can transform traditional two-dimensionally extruded geometries into smooth, 3D curved structures at the wafer-scale. Silicon migration can generate structures that are not possible with traditional fabrication techniques, which opens another dimension for designers to create their micro/nano-devices. This talk will discuss the development of silicon migration as a process tool and explore potential applications. Two recent application of silicon migration include: 1) integration of three-dimensional nano-pores (100 to 300 nm bore) with micro-channels, 2) sealing of release holes for potential use in wafer-level packaging.
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