Prof. Gary Fedder
Institute for Complex Engineered Systems, Carnegie Mellon University
BSAC PhD 1994
February 18, 2010 | 01:00 to 02:00 | 521 Cory Hall, Hogan Room
Host: Clark Nguyen
My research for the past 15 years has revolved around monolithic integration of MEMS with CMOS and development of the requisite design and modeling paradigm to create complex on-chip microsystems. The "More than Moore" trend in the microelectronics industry is accelerating the pace of advanced packaging, which will become increasingly exploited for MEMS integration and blur the lines between monolithic integration and system in package. Integration becomes a necessity for multi-component microsystems, where wiring between MEMS and electronics scales with MEMS component count. As examples of such systems, I’ll first provide a brief overview of the various MEMS design and fabrication efforts in my group. An emerging feature of many of our newest projects is the need for self-configuration and control in the presence of manufacturing and environmental variability. These are general attributes that hold promise of providing high manufacturing yield, resiliency and redundancy for critical applications. One class of such systems are RF circuits tightly integrated with multiple electrothermally actuated MEMS capacitors that lead to a variety of low-loss, frequency reconfigurable circuit blocks. Two other exemplary self-configuring systems that we have recently started working on are micro-instrumented scanning probe arrays for tip-based nanomanufacturing and self-healing resonant mixer-filters for RF front-ends.
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