Roger Grace
President, Roger Grace Associates
September 15, 2015 | 12:00 to 01:00 | 540 Cory Hall
Host: John Huggins
The availability of sensors that can take the shape and work reliably in their imposed complex and demanding working environment has existed for quite some time. Interlink Electronics introduced their flexible "force sensing resistor" product line in 1985. With the recent popularity of the Internet of Things (IoT), "wearables" and more importantly….disposables…create the need for low-cost single or multiple sensors per system that are small, lightweight and low-power consuming that also can conform to the shape of the environment in which they must operate and are becoming essential. This is especially relevant in the creation of measurement systems which typically rely upon several sensors and their accompanying microcontroller/embedded sensor fusion algorithms that make them "smart" and enable them to address a myriad of IoT applications including environmental, fitness and health monitoring.
Based on continuing personal interviews with major participants in this sector, which are expected to exceed 25 by the time of the presentation, I will present several of what I consider to be the more interesting printed, flexible and stretchable (P/F/S) sensor technologies currently under development or in production in the commercial sector that will significant contribute to the achievement of the Trillion Sensors Initiative. Also, to be addressed will be those sensors and their targeted applications currently under development in the leading research universities and research labs around the world. In addition to these sensors, the topic of the integration of the other element of a basic IoT/wearables/disposable sensor-based systems including the power supply/battery, signal conditioning electronics including embedded microprocessors which accommodate sensor fusion requirements, memory, communication ICs and antennas will be addressed. This concept has previously been referred to as…"MEMS-Based Systems Solutions" as well as "Smart System Integration." Also to be addressed will be flexible circuit platforms and their associated interconnectivity issues as part of this smart sensor-based system integration approach.
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