BSAC Seminar: Overview of ANSYS Simulation Software: Multiphysics, MEMS, and Microfluidics to Optimization

April 1, 2014

Ming Yao Ding

Senior Application Engineer, ANSYS, Inc.
April 1, 2014 | 12:30 to 01:30 | 540 Cory Hall
Host: John Huggins

ANSYS Inc., the world leader in engineering simulation software, has broad capabilities in the area of multiphysics that are currently available at BSAC. These capabilities include piezoelectric, thermal electric, thermal structural, thermoelastic, fluid-structural, and more. This presentation and demonstration will provide an overview of these capabilities. Application examples such as MEMS as well as microfluidics will be presented and discussed. Finally, the parametric and optimization capabilities in ANSYS Workbench will be illustrated.  

ansys.com

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BSAC Technology Seminar Series
Hosted by Berkeley Sensor & Actuator Center
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Jonathan Candelaria
Dalene Schwartz Corey