Dr. Christian Rembe
Polytec GmbH
June 16, 2009 | 12:00 to 01:00 | 540 Cory Hall, DOP Center Conference Room
Host: Richard Muller
A new type of microscope, the Laser-Scanning Confocal Vibrometer Microscope, has been proven to be an ideal tool for out-of-plane vibration measurements in MEMS. This microscope can measure vibrations with heterodyne laser-Doppler technique. The phase demodulation of the carrier of the heterodyne-interferometer detector signal reveals the instantaneous displacement signal. The instantaneous vibration spectrum of the specimen can be obtained by FFT technique and operational deflection shapes can be derived by laser scanning measurements. It has been demonstrated in the BMBF-funded (German Ministry for Education and Research) cooperation research project PARTEST that this technique can be integrated into a wafer probe station to measure vibrations and geometries. System parameters can be extracted from the vibration spectra with a fully automated procedure on wafer level under production conditions. The results obtained in the research project are discussed in this seminar. In addition, a novel heterodyne interferometer for ultra-high frequencies is presented. First measurement results obtained at vibration frequencies up to 1.2 GHz are shown.
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