Roger T. Howe (Advisor)

Electromechanical Characterization of Microresonators for Circuit Applications

Clark T.-C. Nguyen
Roger T. Howe
1991
The design of circuits incorporating microresonators which utilize electrostatic drive and sense is accompanied by a need for a convenient method to experimentally extract the circuit elements modelling the microresonators. Previously, techniques which electrically detect microresonator motional current ...

Micromechanical Signal Processors

Clark T.-C. Nguyen
Roger T. Howe
1994
Completely monolithic high-Q micromechanical signal processors constructed of polycrystalline silicon and integrated with CMOS electronics are described. The signal processors implemented include an oscillator, a bandpass filter, and a mixer+filter-all of which are components commonly required for up-...

Micromechanisms Using Sidewall Beams

Michael Judy
Roger T. Howe
1994
A process technology is developed for surface micromachining that achieves sub-micrometer linewidths without the use of advanced lithography equipment. This technique is based upon the sidewall spacer technique that has been used extensively in integrated circuits. The sidewall spacer technique, stated simply, is to deposit a conformal film over a vertical step on the substrate. The conformal film is then anisotropically etched leaving a siclewall spacer or beam. Traditionally these sidewall "stringers" were a nuisance in surface micromachining great care had to be expended to remove...

BSAC Researchers Advised by Professor Roger T. Howe

A High-Resolution Resonant MEMS Strain Gauge

Mark Wolfson
Albert P. Pisano
Roger T. Howe
Oliver M. O'Reiily
2000

An investigation into the development of a high-resolution micro-strain gauge is discussed here. The design presented is a resonant sensor in the form of a double-ended tuning fork (DETF) that employs MEMS technology to achieve maximum sensitivity at...

Ultra High Frequency Piezoelectric Resonators: Suspension and Elastic Coupling

James Porter
Albert P. Pisano
Roger T. Howe
Liwei Lin
2004

In this research project, the suspension and elastic coupling of Film Bulk AcousticResonators (FBAR) has been investigated. Individual resonators and small arrays of AlN FBARs have been designed and fabricated in a post-CMOS compatible process. Suspensions based on networks of thin beams did not perform well, but m...

Design Issues For Differential Z-Axis Accelerometers

Monico Ortiz
Bernhard E. Boser
Roger T. Howe
1996

Accelerometers which are sensitive to inputs perpendicular to the substrate (2-Axis) are the key to monolithic three axis acceleration sensing. The inherent asymmetry of the capacitive interface of the Z-Axis sensing element fabricated in surface micromachining technology with a single...

Microresonators as Vacuum Gauges

Sharon Oh
Roger T. Howe
Liwei Lin
2001
Resonators are sensitive to physical inputs such as pressure and force. The parameters of interest are measured by the shift in resonance frequency. The ease of measurement and their high sensitivity make resonators an attractive means of measuring many...

High-Senstivity Micromechanical Electrostatic Voltmeter

David Loconto
Richard S. Muller
Roger T. Howe
1992

The design, fabrication and testing of electrostatically drive, high-sensitivity dc voltmeters (ESVs), which have demonstrated sensitivity to 10 mV signals is presented in this report. The ESVs have a micromachined test electrode (third layer of polysilicon) 5 um above the shutter, which provides testing repeatability, increased sensitviy to the input and most importantly the ability to accurately model ESV performance. The theoretical first- and second-harmonic output currents are derived. The results of predicted and experimentally meausred signals are compared and show the validity of...

Electrical Interconnect of Components Transferred by Fluidic Microassembly Using Capillary Forces

Karen Scott
Roger T. Howe
Clayton J. Radke
John S. Smith
2003
As Micro ElectroMechanical Systems become more complicated, building them asintegrated systems may not be possible and exploring new microassembly technologies becomes necessary. Capillary-based fluidic microassembly is of ...