Publications

A harsh environment can be defined by one or more of the following: High temperature, high shock, high radiation, erosive flow, and corrosive media. Among all the harsh environment applications, high temperature applications have drawn lots of attention due to the emerging activity in automotive, turbine engine, space exploration and deep-well drilling telemetry. Silicon carbide has become the candidate for these harsh environment applications because of its wide bandgap, excellent chemical and thermal stability, and high breakdown electric field strength. This dissertation details...

Harsh environment applications include high temperature, pressure and mechanical shock. Aluminum nitride is a strong ceramic material with very good high temperature survivability. It also has piezoelectric properties that can be used for sensing applications and it can be deposited with good control as thin polycrystalline film for the fabrication of micro-electromechanical systems. In this dissertation, optimized deposition parameters for aluminum nitride films and characterization techniques for film stress gradients are investigated. Furthermore, two diff...

Much of the world consists of many small things, animate or inanimate, interacting with each other to produce something larger than, and different from themselves. Comprising murders of crows, armies of ants, schools of fish, dunes of sand, and various organs in your body, the collective behaviors of these systems embody a different approach to engineering than we currently employ. This thesis explores three examples where principles from collective behaviors are deployed as engineering tools. The first example presents how the collective phenomenon of ‘percolation’ can be leveraged...

The three-dimensional thermal ground plane was developed in response to the needs of high-power density electronics applications in which heat must be removed as close to the chip surface as possible. The novel design for this planar cooling device was proposed with three key innovations in the evaporator, wick, and reservoir layer, which provided enhanced and reliable cooling performance without wick dryout and back flows. For the evaporator and reservoir layer, a combination of a tapered channel and a triple-spike microstructure was designed to break up the pinned meniscus at the...