Abstract:
We report on 32×32 silicon photonic switches realized through wafer bonding. Broadband operation is demonstrated over 1260-1320 nm range. The maximum on-chip loss is measured to be 4 dB and the cross-talk is −80 dB.
Keywords: Wafer bonding, Optical losses, Optical switches, Microswitches,Silicon photonics, Loss measurement, Optical fiber communication
Publication date:
March 10, 2022
Publication type:
Conference Paper (Proceedings)
Citation:
A. Honardoost, J. Henriksson, K. Kwon, J. Luo and M. C. Wu, "Low-Loss Wafer-Bonded Silicon Photonic MEMS Switches," 2022 Optical Fiber Communications Conference and Exhibition (OFC), San Diego, CA, USA, 2022, pp. 1-3. http://dx.doi.org/10.1364/OFC.2022.M2D.8