Abstract:
The MEMS strain gauge on steel project aims to design a MEMS strain gauge that can be bonded directly to steel and accurately measure strain in small strain fields (gauge length of 1 mm or less). Encapsulation of the MEMS strain gauge, in contrast to microelectronics or inertial force sensor packaging, requires that the package be a mechanical transducer of the measurand to the sense elements. To meet the objective of hermetic, minimally-aliasing encapsulation of the strain gauge, we propose an elastic, wafer-level solution.
Project end date: 01/26/07
Publication date:
August 23, 2006
Publication type:
BSAC Project Materials (Final/Archive)
Citation:
PREPUBLICATION DATA - ©University of California 2006