Ming C. Wu (Advisor)

Microring and microdisk resonators are key components to realize silicon monolithic optoelectronic devices because they have the potential of integration with current CMOS electronic devices. The applications include most wavelength-division-multiplexing photonic circuits, such as optoelectronic transceivers, wavelength filters, add-drop multiplexers, optical delay lines, and group velocity dispersion compensators. Furthermore, in order to achieve dynamic switching functions, tunable capability is desired. Here we propose a tunable microring resonator with integrated MEMS actuators,...

Single cell analysis is an important technology for biological and medical research. The precision of manipulating the location of the single cell (relative to the assay sites or other neighboring cells) is a necessary factor. We have previously demonstrated cell manipulation and separation with optoelectronic tweezers (OET), the goal of this project is to integrate this powerful tool with the micrifluidic devices to provide a complete solution for single cell electroporation.

Project end date: 07/30/08

Optical manipulation provides a non-invasive, dynamic, and reconfigurable method of trapping, transporting, and sorting cells and other bioparticles. Optoelectronic tweezers (OET) enables optically-controlled cellular manipulation at much lower optical power densities than conventional optical tweezers. This enables the use of direct imaging and incoherent light to create a large (1.3 mm x 1.3 mm) manipulation area for the parallel processing of cells, microparticles, and nanoparticles. The use of direct image-actuated OET allows single-particle control for biological research and...

Semiconductor lasers on a silicon platform have attracted much attention due to the potential of integration with CMOS integrated circuits. Silicon Raman lasers have been demonstrated, however, they still require external optical pumps. Heteroepitaxy can grow compound semiconductor lasers directly on Si, but the growth temperature (> 400oC) is usually too high for post CMOS processing. To circumvent this issue, electrically-pumped compound-silicon hybrid lasers have been integrated on Si wafers utilizing oxygen plasma-assisted wafer bonding or DVS-BCB-assisted bonding techniques....