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BPN721: MEMS-Electronic-Photonic Heterogeneous Integration (MEPHI) Component Characterization

Project ID BPN721
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Start Date Wed 2013-Aug-14 20:43:15
Last Updated Sat 2014-Feb-01 16:05:48
Abstract Active III-V photonic components and passive Si photonic circuits are integrated with CMOS electronic circuits to create an integrated optoelectronic phase-locked loop. The OPLL will be utilized to generate an optical linear frequency chirp for target detection and ranging. One goal of the project is to develop the ability to fabricate 3D-integrated devices on the wafer level. This requires proper device and module characterization and a deep understanding of the integration process as well as system feedback parameters. Many characterization methods are being been developed and used to constrain device and module design parameters and predict LADAR performance before and after integration processes.
Status Continuing
Funding Source DARPA
IAB Research Area NanoPlasmonics, Microphotonics & Imaging
Researcher(s) Phillip A.M. Sandborn, Behnam Behroozpour, Niels Quack, Sangyoon Han
Advisor(s) Ming C. Wu
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